Projection exposure apparatus with near-field manipulator

ABSTRACT

A semiconductor lithography projection exposure apparatus includes a projection lens which includes a manipulator. The manipulator includes an optical element; a base frame; a sensor frame arranged on the base frame; and a sensor arranged on the sensor frame. The manipulator is configured to correct wavefront aberrations of used optical radiation that pass through the optical element during the operation of the projection lens. The manipulator is arranged directly after an object plane of the apparatus along a path of the used optical radiation. The sensor is configured to measure a deformation or a deflection of the optical element. A coefficient of thermal expansion of the sensor frame is within 16 ppm/K of a coefficient of thermal expansion of the base frame.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of, and claims benefit under35 U.S.C. 120 to, international application PCT/EP2015/060702, filed May13, 2015, which claims benefit under 35 U.S.C. 119 of German ApplicationNos. 10 2014 209 147.0; 10 2014 209 149.7; 10 2014 209 160.8; 10 2014209 150.0; 10 2014 209 151.9 and 10 2014 209 153.5, filed May 14, 2014.The entire disclosure of international application PCT/EP2015/060702 andGerman Application Nos. 10 2014 209 147.0; 10 2014 209 149.7; 10 2014209 160.8; 10 2014 209 150.0; 10 2014 209 151.9 and 10 2014 209 153.5are incorporated by reference herein.

FIELD

The disclosure relates to a projection exposure apparatus forsemiconductor lithography with a manipulator for image error correction.

BACKGROUND

The known way in which projection exposure apparatuses for semiconductorlithography work is based essentially on the idea that structures, thatis to say for example conductor tracks, but also transistors or thelike, are produced on semiconductor components by an image of structuresthat are present on a mask, known as a reticle, being projected via alens onto a photosensitive resist arranged on a semiconductor wafer andby the desired topography of the component being produced sequentiallyin subsequent steps, in particular by corresponding coating or etchingprocesses. This generally involves the lens bringing about aconsiderable reduction in the size of the structures that are present onthe reticle, usually by 4-10 times.

The structures that can at present be produced have dimensions in therange of several nanometers, which imposes considerable desiredproperties on the quality of the lens that is used for the exposure. Inparticular, it is desirable to be able to compensate for any imageerrors as quickly as possible and in a way appropriate for thesituation. So-called manipulators may be used for example for errorcorrection. Such manipulators may in particular comprise opticalelements, which can be moved or deformed via suitable actuators forlocally influencing a wavefront.

A corresponding concept is described in European Patent EP 1 014 139 B1.The document mentioned discloses, inter alia, a projection exposureapparatus that includes a manipulator with an optical element, such asfor example a lens or mirror, which is deformed in a specificallyselective manner by actuating units for purposes of optical correction.In EP 1 014 139 B1, the concept pursued there is explained on the basisof a deformable lens.

SUMMARY

It has been found that at least some known manipulators are notoptimally suitable for the correction of all image errors. Overlayerrors for example involve correction concepts that cannot be realizedin an optimum way via the manipulators known from the prior art. Withconcepts known so far, it is also only possible with difficulty torealize high degrees of waviness on optical elements, which may beinvolved in particular for the correction of overlay errors. Thewaviness is in this case a measure of how many wave peaks or wavetroughs occur in a cross-sectional representation of the optical elementover the entire lateral extent of the optical element.

The disclosure seeks to provide a projection exposure apparatus forsemiconductor lithography that offers extended possibilities for thecorrection of image errors, in particular for the correction of overlayerrors.

In one aspect, the disclosure provides projection exposure apparatusaccording to the disclosure for semiconductor lithography has amanipulator for the correction of wavefront aberrations of the usedoptical radiation that passes through an optical element of themanipulator during the operation of the projection lens. In this case,the manipulator is arranged directly after a reticle of the projectionexposure apparatus in the direction of the used optical radiation.

The arrangement of the manipulator directly after the reticle in thiscase allows a particularly efficient correction, in particular ofoverlay errors. The fact that the optical element can be produced as aplane-parallel element, in particular as a plane-parallel plate with arectangular base form, means that, as a result of the geometry, theinvolved high degrees of waviness can be produced relatively easily.

In an advantageous variant of the disclosure, actuating units for thedeformation or movement of the optical element are arranged along theperiphery of the optical element and are mechanically connectedindirectly or directly to contact regions of the optical element on theone hand and to a base frame on the other hand. The base frame may inthis case for its part be connected to a mount of a first opticalelement of the projection lens.

In particular, the optical element may be arranged by way of theactuating units on a supporting frame, which for its part is arranged onthe base frame. The supporting frame can in this case support theoptical element of the manipulator—for example by way of actuatingunits. In this case it not only takes the weight of the optical elementbut also absorbs the forces from the actuating units, in particular inthe case of a (desired) deformation of the optical element.

In particular whenever the supporting frame is produced from anon-magnetic material, in particular a non-magnetic steel, or from aceramic material, the harmful influence of changing magnetic fields, ascould be caused for example by the movement of the reticle stage byLorentz actuators, can be reduced.

Alternatively, the optical element may be arranged by way of theactuating units directly on the base frame, whereby a simplified overallconstruction of the arrangement is obtained.

The actuating units may in particular comprise actuators that are formedas piezo stacks.

The use of piezo actuators, in particular piezo stacks, allows acomparatively precise positioning to be achieved with little developmentof heat—for example in comparison with Lorentz actuators.

In an advantageous variant of the disclosure, the actuating unit may beconstructed in the manner of a parallelogram, it being possible for theinterior angles of the parallelogram to be changed by an actuator. Ascompared with actuation by way of levers, in particular tilting levers,the advantage of this solution is essentially that with this variantthere is less change in the parasitic forces and moments in response toa change in load (actuation of other actuator units), which is alsoadvantageous with regard to the optical performance of the system.

In this case, the effective direction of the actuator may extend inparticular in the direction of a diagonal of the parallelogram;deviations from a diagonal extent of the effective direction are alsoconceivable. Thus, the actuator force may also act at a point ofarticulation or at points of articulation on one side of theparallelogram, that is to say not necessarily at a corner.

In particular, there may be at least one sensor for measuring thedeformation or the deflection of the optical element. In this case, thesensor may perform the measurement from the underside and/or the upperside of the optical element. Simultaneous measurements on the upper sideand the underside of the optical element are likewise conceivable. As aresult, measuring errors can be reduced and the measuring accuracy canbe increased. In particular, measuring can also be performedsimultaneously at regions corresponding to one another, that is to sayat regions lying opposite one another at the same x/y position.

In the present case, the x direction and the y direction are intended tobe understood as meaning those spatial directions that define a planewhich lies perpendicularly to the optical axis of the higher-levelsystem—that is to say generally to that of the projection lens.

The z direction in this case extends in the direction of the opticalaxis, the x, y and z directions together defining a system of Cartesiancoordinates.

The at least one sensor may measure a deflection of a component of anactuating unit; it is similarly conceivable that the at least one sensormeasures a deflection of the optical element directly.

Furthermore, the at least one sensor may be formed as an optical, inparticular interferometric, sensor or encoder.

In the case of the use of an interferometric sensor, the use of afiber-coupled interferometer comes into consideration in particular. Itis similarly possible to use fiber Bragg gratings, which makemultichannel measurement easily possible by using individual sensorsconnected in series, so that all of the sensors addressed can beinterrogated with a single fiber.

In a variant of the disclosure, the at least one sensor may be formed asa capacitive sensor. The use of capacitive sensors is conceivable inparticular in cases in which the sensor measures the deflection of acomponent of an actuating unit. In principle, however, it is alsopossible to measure deflections or deformations of the optical elementdirectly with a capacitive sensor. In this case, a conductive coating ofthe region addressed by the sensor on the surface of the opticalelement, for example a metallization, may be advantageous.

In further embodiments of the disclosure, the sensors may be formed asinductive sensors or eddy current sensors.

An embodiment of the at least one sensor as a force sensor is alsoconceivable.

For exact control of the deformation of the optical element, it is ofadvantage if a plurality of sensors are arranged along the periphery ofthe optical element.

In an advantageous embodiment of the disclosure, the at least one sensoris arranged on a sensor frame, which serves for decoupling the sensorsfrom deformations and thus ensures a stable sensor reference.

The sensor frame may in particular be arranged on the base frame. Thisensures a dual decoupling of the sensor frame from deformationsoriginating from the actuating units, since in the case where theactuating units are mounted on a supporting frame they are likewisedecoupled in terms of deformation with respect to the base frame. Anarrangement of the sensor frame on the supporting frame is alsoconceivable. In both cases, the sensor frame may be isostaticallymounted. It is also conceivable to decouple the sensor frame from thebase frame; but to connect the actuating units directly to the baseframe, in particular by screwing.

The sensor frame may be formed from titanium or aluminum, an alloycontaining the materials mentioned, Zerodur, ULE or (Si) Sic; it isadvantageous if the coefficient of thermal expansion of the sensor frameis adapted to that of the base frame.

The fact that the sensor frame is formed from a material that has a CTEvalue of 0-12 ppm/K, means that an increased insensitivity of the systemto temperature fluctuations can be achieved.

It is also conceivable to keep down the deviations of the CTEs of thesensor frame, the base frame and the supporting frame from one another.An advantageous range in which the deviations may lie is a range ofabout 16 ppm/K.

A great stiffness of the sensor frame is also desirable. Advantageously,the sensor frame is formed from a material that has a modulus ofelasticity value of 60-400 GPa.

BRIEF DESCRIPTION OF THE DRAWINGS

Advantageous embodiments and variants of the disclosure are explained byway of example below on the basis of the drawings, in which:

FIG. 1 shows a schematic representation of a projection exposureapparatus;

FIG. 2 shows a schematic representation of an embodiment of amanipulator according to the disclosure;

FIG. 3 shows a schematic sectional representation of a manipulator;

FIG. 4 shows a schematic representation of an exemplary embodiment of anactuating unit with a sensor;

FIG. 5 shows a schematic representation of a further embodiment of anactuating unit;

FIG. 6 shows a first possibility for the introduction of forces into anoptical element;

FIG. 7 shows a further possibility for the introduction of forces intoan optical element;

FIG. 8 shows a schematic representation of a further variant for theintroduction of forces into an optical element;

FIGS. 9a-9b show various variants for the design of a plunger;

FIGS. 10a-10b show a further possibility for the introduction of forcesinto an optical element;

FIGS. 11a-11b show a further possibility for the introduction of forcesinto an optical element;

FIGS. 12a-12b show variants for the design of a groove;

FIGS. 13a-13b show further variants for the design of a groove;

FIGS. 14a-14b show variants for the design of an optical element;

FIGS. 15a-15b show further variants for the introduction of forces intoan optical element;

FIGS. 16a-16b show a schematic representation of the introduction of aforce or a moment into an optical element;

FIG. 17 shows an exemplary distribution of contact regions on an opticalelement;

FIG. 18 shows a further variant for the distribution of contact regionson an optical element;

FIG. 19 shows a variant for the arrangement of measuring points andcontact regions on an optical element;

FIG. 20 shows a further variant for the arrangement of measuring pointsand contact regions on an optical element;

FIG. 21 shows a further variant for the arrangement of measuring pointsand contact regions on an optical element;

FIG. 22 shows a variant for the protection of an optical element frompressure surges;

FIG. 23 shows a possibility for the design of an optical element;

FIGS. 24a-24b show a variant of the design shown in FIG. 23;

FIGS. 25a-25b show a further variant of the design of an opticalelement; and

FIG. 26 shows an exemplary representation of an optical element inconnection with a manipulator.

DESCRIPTION

In FIG. 1, a projection exposure apparatus 100 according to thedisclosure is represented. This apparatus serves for the exposure ofstructures on a substrate which is coated with photosensitive materials,generally consists predominantly of silicon and is referred to as awafer 102, for the production of semiconductor components, such ascomputer chips.

The projection exposure apparatus 100 in this case consists essentiallyof an illumination device 103, a device 104 known as a reticle stage forreceiving and exactly positioning a mask provided with a structure, aso-called reticle 105, by which the later structures on the wafer 102are determined, a device 106 for holding, moving and exactly positioningthe wafer 102 and an imaging device, to be specific a projection lens107, with multiple optical elements 108, which are held by way of mounts109 in a lens housing 140 of the projection lens 107.

The basic functional principle in this case provides that an image ofthe structures introduced into the reticle 105 is projected onto thewafer 102, the imaging generally being on a reduced scale.

The illumination device 103 provides a projection beam 111 in the formof electromagnetic radiation, which is used for the imaging of thereticle 105 on the wafer 102. A laser, plasma source or the like may beused as the source of this radiation. Optical elements in theillumination device 103 are used to shape the radiation in such a waythat, when it is incident on the reticle 105, the projection beam 111has the desired properties with regard to diameter, polarization, formof the wavefront and the like.

An image of the reticle 105 is produced by the beams 111 and transferredfrom the projection lens 107 onto the wafer 102 in an appropriatelyreduced form, as already explained above. In this case, the reticle 105and the wafer 102 may be moved synchronously, so that images of regionsof the reticle 105 are projected onto corresponding regions of the wafer102 virtually continuously during a so-called scanning operation. Theprojection lens 107 has a multiplicity of individual refractive,diffractive and/or reflective optical elements 108, such as for examplelens elements, mirrors, prisms, terminal plates and the like.

The arrangement of the manipulator 200 in the region between the reticlestage 104 and the first optical element of the projection lens 107 canalso be seen well in FIG. 1.

In FIG. 2, a manipulator 200 according to the disclosure isschematically represented in somewhat more detail in a perspectiverepresentation. The manipulator 200 is in this case connected, inparticular screwed, to the mount 3 of the first optical element of theprojection lens by way of a base frame 4. In the present example, thebase frame 4 is connected to the projection lens by a 3-pointconnection, which makes it easily possible for it to be reproduciblyexchangeable. In the example shown, one function of the base frame 4 isto receive both a sensor frame 5 and a supporting frame 6, which will bediscussed in more detail below. It is in this case advantageous if thebase frame 4 provides a mechanical decoupling between the supportingframe and the sensor frame 5, 6, i.e. it is intended to be ensured thatdeformations of the supporting frame 6 have no mechanical effects on thesensor frame 5. Furthermore, the base frame 4 hold the twoaforementioned frames 5 and 6 in relation to the projection lens anddecouple deformations from the supporting frame 6 with respect to thesurroundings. In addition, the base frame 4 also receives the externalinterfaces, such as for example connectors, covers or the like. The baseframe 4 is advantageously produced from a non-magnetic material, such asfor example titanium, a non-magnetic steel or a ceramic, in order tominimize as much as possible influences that could be caused by themagnetic Lorentz drives of the reticle stage. Grooves 7 for routingcables, fibers or the like can likewise be seen in FIG. 2.

The supporting frame 6 supports the optical element 9 of the manipulator200 by way of the actuating units 8 and not only takes the weight of theoptical element 9 but also absorbs the forces from the actuating units8, in particular in the case of a (desired) deformation of the opticalelement 9.

In the present example, the optical element 9 consists of quartz glass;in its basic form, it is formed as a plane-parallel plate and has thedimensions in the range of 50-100×100-200×1-4 mm, in particular of65-85×120-160×2.3-3.3 mm. It goes without saying that other dimensionsand materials are also conceivable. The use of quartz glass has provento be advantageous, by contrast in particular with calcium fluoride inwhich crystal lattice dislocations have a tendency to migrate, whichwould have an adverse effect overall on the optical and mechanicalperformance of the optical element and the manipulator.

In the example shown, the supporting frame 6 is connected on itsunderside to the base frame 4. It is of advantage for the supportingframe 6 to be of a form that is as stiff as possible, it being possiblefor the supporting frame 6 to be produced in particular from a ceramicmaterial or else—in a way similar to the base frame 4—from anon-magnetic steel. In an alternative to the solution shown, thesupporting frame 6 may also be omitted. In this case, the actuatingunits 8 would be received directly by the base frame 4. As alreadymentioned and shown in the figure, the base frame 4 is connected notonly to the supporting frame 6 but also to the sensor frame 5. Thesensor frame 5 may for example carry capacitive sensors or else opticalsensors and may in particular be formed from titanium or aluminum orcorresponding alloys or from ULE or Zerodur. An adaptation of thecoefficient of thermal expansion of the sensor frame 5 to that of thebase frame 4 is in this case of advantage. Furthermore, the sensor frame5 may be formed from a material that has a CTE value of at most 0-12ppm/K. The sensor frame 5 is mechanically decoupled from the base frame4 in such a way that deformations of the base frame 4 are not alsomanifested as deformations of the sensor frame 5. Possibilities ofadjustment may be provided both in the supporting frame 6 and in thesensor frame 5, in order to position the actuating units 8 or thesensors in all degrees of freedom; in particular, so-called spacers maybe used here, that is to say spacing rings or spacing elements. In thiscase, an adjustment in the acting direction of the actuating units 8 orin the measuring direction of the sensors is of particular importance.Connecting elements may be used not only for connecting the sensor frame5 to the base frame 4 but also for connecting the supporting frame 6 tothe base frame 4 and the base frame 4 to the projection lens, it beingpossible for the connecting elements to have a decoupling effect or foradditional decoupling elements to be present. It is in this case ofadvantage if the connecting elements or the decoupling elements aredesigned to be as flexible as possible in the radial direction and asstiff as possible in the z direction, that is to say in the direction ofthe optical axis. This can be achieved for example by the use ofappropriately aligned and designed leaf springs.

As already mentioned, in addition to the variant of a manipulator 200according to the disclosure that is represented in FIG. 2, it isconceivable that the supporting frame 6 and/or the sensor frame 5 areomitted, i.e. that both sensors and actuating units are arrangeddirectly on the base frame 4.

In FIG. 3, a sectional view of an alternative embodiment of themanipulator (200) according to the disclosure is schematicallyrepresented. In this embodiment, the base frame 4′ is formed in such away that it largely covers the sensor frame 5, and consequently extendsessentially right up to the edge regions of the optical element 9. Inthe sensor frame 5, a light beam is coupled out from a fiber 20, runsfreely in optical terms over a certain distance and is incident on aprism 19, which deflects it in the direction of the glass surface 21.The reflection at the glass surface 21 subsequently produces aself-interference of the light beam, which can be evaluated in adownstream evaluation unit (not represented here), so that thedeflection of the optical element 9 at the particular time that isbrought about by the actuating units 8 at the corresponding location canbe determined. Alternatively, a capacitive measurement may also takeplace; in this case, a metallization, and possibly a grounding, of theoptical element 9 in the region of the measuring points is of advantage.Likewise shown in FIG. 3 is a seal 2, running around the optical element9, between the optical element 9 and the base frame 4′. The seal 2 mayin particular be produced from an elastomer such as for example FKM(tradename Viton). Alternatively, an elastic adhesive may also be usedin the manner of an elastic (expansion) joint. Very low rigidity is adesired mechanical property for the sealing compound that is used, inorder to make a certain allowance for aging of the seal possible.

In FIG. 4, an exemplary embodiment of an actuating unit 8 with a sensor14 for the indirect measurement of deformations of the optical element 9is schematically represented. The actuator 81 is used to deflect a lever12, which is mounted by leaf springs 13. In this case, the leaf springs13 and the actuator 81 are for their part connected to the supportingframe 6. The lever 12 is in mechanical connection with the opticalelement 9 by way of a plunger 10 and two connecting layers 11.1 and11.2, which are realized for example by using an adhesive. Themechanical connection 11.2 is not absolutely necessary here; it mayhowever be of advantage for servicing reasons (repair of the componentand so on).

On the side opposite from the actuator 81, the supporting frame 6 hasthe sensor 14. In the present example, the measurement of thedeformation of an optical element 9 takes place via the sensor 14 in theactuating unit 8. The determined movement that is transferred by theactuating unit 8 to the optical element 9 by way of the lever 12 and theplunger 10 can then be used to infer the deflection or the position ofthe surface of the optical element 9. In the example shown, a certainmeasuring uncertainty is caused, inter alia, by the two connectinglayers 11.1 and 11.2, where a drift may occur, which may lead to afalsification of the measuring result. Alternatively, force sensors maybe used for measuring the deformation of the optical element 9. Such ameasurement has in particular the advantage of greater robustness of themeasuring result with respect to crosstalk from other measuring axes. Inother words, the influence of the movement of other axes on themeasuring signal of an axis (for example when measuring in the actuatingunit) is reduced. However, here there is a certain difficulty in thatparasitic forces are introduced into the system by the movement of thereticle stage and can have the effect that the measuring result islikewise falsified.

In principle, an actuation (that is to say a deformation and/or adeflection) of the optical element without the use of sensors, that isto say a controlled actuation, is also conceivable. In this case thereis a desire for increased accuracy and resolution of the actuating unitto achieve a satisfactory result in the setting of the desireddeformation. Force actuating units or position actuating units may beused. Typical examples of force actuating units are plunger coils,pneumatic or hydraulic actuating units or else reluctance actuatingunits. This variant is distinguished by low rigidity between the opticalelement and the frame on which the actuating units are mounted.

Examples of position actuating units are piezo actuators, possiblymagnetic shape-memory elements or else stepping motors; which aredistinguished by a high degree of stiffness between the optical elementand the frame on which the actuating units are mounted. The use of piezoactuators, in particular piezo stacks, additionally allows acomparatively precise positioning to be achieved with little developmentof heat—for example in comparison with Lorentz actuators.

In principle, by using appropriate additional elements such as springsor levers, force actuating units can be converted into positionactuating units, and vice versa. A decisive factor for the actuatingconcept is the resultant stiffness between the optical element and theframe on which the actuating unit is arranged.

FIG. 5 schematically shows an alternative configuration of an actuatingunit 8′, in which so-called parallel kinematics are used. In the casethat is shown, the actuating unit has an actuating body 15, which isconnected by way of flexures 16 to two essentially parallel runningbeams 17 and 17′, and with these and a further beam 17″ forms aparallelogram. In this case, a plunger 10.11 is arranged on the furtherbeam 17″ for the actuation of an optical element. The actuator 81′,which is connected likewise by way of flexures 16′ to the actuator body15, extends in a diagonal of the parallelogram. When there is anextension or shortening of the actuator 81′, which may in particular beconfigured as a piezo stack, the two beams 17 and 17′ move in parallel,so that an actuation of an optical element that is not shown in thefigure can take place by way of the actuating unit 8′. As compared withan actuation by way of levers, in particular tilting levers, theadvantage of the solution shown is essentially that, in the variant thatis shown in the figure, there is not such a great change in theparasitic forces and moments when there is movement of other regions,for example in the case of a change in the deformation profile of theoptical element, which is extremely advantageous from the aspect ofoptical performance.

Possible combinations of actuating units and sensor types for acontrolled deformation/deflection of the optical element are compiled byway of example below.

Position Actuating Unit/Position Measurement

Distinguished by a stiff actuating unit. The optical element is in thiscase measured via a position sensor that is sufficiently robust withrespect to crosstalk from other regions, possibly a contactless positionsensor, for example directly, via an external mechanism or in theactuating unit itself.

Examples

Piezo actuating unit, interferometric position measurement

Piezo actuating unit, capacitive position measurement

Piezo actuating unit, mechanics, capacitive position measurement

Stepping-motor actuating unit, encoder

The use of capacitive sensors is conceivable in particular in cases inwhich the sensor measures the deflection of a component of an actuatingunit. In principle, however, it is also possible to measure deflectionsor deformations of the optical element directly with a capacitivesensor. In this case, a conductive coating of the region addressed bythe sensor on the surface of the optical element, for example ametallization, may be advantageous.

In the case of the use of an interferometric sensor for the positionmeasurement, the use of a fiber-coupled interferometer comes intoconsideration in particular. It is similarly possible to use fiber Bragggratings, which make multichannel measurement easily possible by usingindividual sensors connected in series, so that all of the sensorsaddressed can be interrogated with a single fiber.

Force Actuating Unit/Position Measurement

Distinguished by a sufficiently accurate (typically in the single-digitnm range) actuating unit. The optical element is in this case measuredvia a sufficiently accurate, possibly contactless, position sensor, forexample directly, via an external mechanism or in the actuating unititself.

Examples

Plunger-coil actuating unit, interferometric position measurement

Reluctance actuating unit, capacitive position measurement

Pneumatic or hydraulic actuating unit, encoder

Force Actuating Unit/Force Measurement

Distinguished by a sufficiently accurate (see above) actuating unit. Theforces acting on the optical element are measured via a stiff forcesensor in the force path.

Example

Plunger-coil actuating unit on load cell.

Position Actuating Unit/Force Measurement

Distinguished by a very rigid actuating unit that is robust with respectto crosstalk. The forces acting on the optical element are measured viaa stiff force sensor in the force path.

Example

Piezo actuating unit with a strain gauge.

The conditions in the area surrounding the region of an optical elementon which actuator forces act is to be illustrated once again on thebasis of FIG. 6, in a sectional partial representation. The opticalelement 9 may in this case be the optical element that is used in themanipulator (200) shown above; in principle, the solutions that arerepresented in the following figures can however be applied to a largenumber of extremely varied actuated optical elements. In the variantthat is shown in the figure, the optical element 9 for the introductionof forces via an actuable plunger 10 is in connection by way of aconnecting layer 11, in particular a layer of adhesive or a solderedconnection. The actuating force is in this case indicated by thedouble-headed arrow. As a difference from the solutions known frommounting technology, in particular of lens elements in projectionlenses, in which optical elements are mounted directly on possiblyactuable spring legs, here there is no direct contact between theplunger 10 and the material of the optical element 9, but instead theforces from the plunger 10 are transferred to the optical element 9 byway of the material of the connecting layer 11. The introduction offorce serves in the present case less for a movement of the opticalelement 9 as a whole, but rather for a local deformation of the opticalelement 9, for example for the setting of a desired waviness over theoptical element 9. However, as represented in the figure, the localdeformation may be manifested in particular by a bending of the opticalelement 9 also in the region of the connecting layer 11—referred tohereinafter as the contact region 36—which may lead to undesiredstresses in the connecting layer 11, and consequently to creepage ordegradation, even to the extent of the connecting layer 11 beingdestroyed.

The contact region 36 may have a maximum lateral extent or, in the caseof a circular form of the contact region 36, a diameter of about 2-15mm, in particular of about 3-6 mm; the connecting layer 11 may have athickness of about 20 μm-400 μm, in particular of about 90-130 μm. Areduction in the thickness of the connecting layer would lead to reducedcreepage as a result of the connecting layer, so that it is possible ordesirable for the connecting layer to be chosen to be thinner.High-grade steel X14 or X17, Invar or else TiAl6V4 or other titaniumalloys may be used for the material of the plunger. As a result of thenon-magnetic properties, in particular of the last-mentioned material, aharmful influence of the magnetic fields emanating from the reticlestage, such as for example magnetostriction, is minimized. In addition,TiAl6V4 proves to be advantageous because it has a coefficient ofthermal expansion that is closer to the coefficient of expansion of theoptical element than the non-magnetic steels that likewise come intoconsideration.

FIG. 7 likewise shows in a sectional representation of a detail avariant in which bending of the optical element 9.1 in the contactregion 36 is reduced. Here, too, a plunger 10.1 acts by way of thecontact region 36 on the optical element 9.1 for the specificallyselective deformation thereof. An annular peripheral groove 22 runningaround the contact region 36 is clearly visible. The effect of thegroove 22 is essentially that, when there is a deformation of theoptical element 9.1, the curvature or bending of the surface areas inthe contact region 36 is reduced, and consequently the connecting layer11.1 remains under low stress. The groove 22 displaces the flexuralstresses occurring into the interior of the optical element 9.1. With asufficient depth of the groove 22, it acts together with the material ofthe optical element 9.1 that remains in the area surrounding it in themanner of an articulated joint.

It goes without saying that the peripheral groove does not necessarilyhave to be of an annular form. Depending on the design of the contactlocation, it is conceivable for the groove to follow different paths.

The flexural stress in the contact region 36 is therefore essentiallyreduced, while the compressive stress that is of course involved for theactuation or deformation of the optical element 9.1 is retained. Thefact that the connecting layer 11.1 is kept essentially free from shearforces in the way according to the disclosure means that altogether thedurability of the connection is improved and the performance and servicelife of the system as a whole are increased. In particular, creepage ofthe connecting layer 11.1 is reduced. The distance of the groove 22 fromthe edge of the contact region 36 should in this case be chosen to be assmall as possible. The annular design of the groove 22 is appropriate inparticular for cases in which the optical element 9.1 is deformed oractuated with changing directions of the load or of the bending. Inother applications, it is of course conceivable for the groove 22 tofollow different paths, for example linear paths.

The groove 22 may be ground or milled in via a forming tool, that is tosay a positive body. A further etching or polishing step may possibly beperformed for eliminating or reducing damage at depth, whereby stresspeaks and possible starting points of damage to the material understress can be avoided.

FIG. 8 shows a variant in which the plunger 10.2 is formed in such a waythat it tapers in the direction away from the optical element 9.2. Thisform of the plunger 10.2 is based on the recognition that, even withoptimally designed grooves, a residual bending of the optical element inthe content region can still be observed. A plunger of maximum stiffnesswould have the effect that stress peaks would occur in the edge regionsof the contact region as a result of the bending referred to above. Forthis reason it is advantageous to design the plunger 10.2 to be moreflexible toward the outer regions of the contact region 36, which isachieved by the plunger geometry that is shown in the figure. In thiscase, the effect referred to occurs both under tension and undercompression.

Likewise represented in the figure are essential parameters fordescribing the system,

where

-   a is the groove depth-   r is the radius of the groove 22.1 on the side of the groove 22.1    that is facing the contact region-   t is the thickness of the optical element 9.2

When there is only a main direction of extension in the region of theconnecting location, the introduction of a groove transversely to thisdirection may be sufficient for decoupling stress. An advantageous rangefor the groove depth a is:

$\frac{1}{4} < \frac{a}{t} < \frac{3}{4}$

When using a radius in the groove, the following range is of advantage:

$\frac{1}{4} < \frac{r}{a} < 2$

Further variants of plunger design are shown in FIGS. 9a and 9b on thebasis of the modified plunger 10.3 or 10.4. Of advantage is the largeshoulder shown in FIG. 8, the planar surface of which can be used as areference in the mounting/adjusting process.

An advantageous specification for the boundary conditions to be appliedwhen choosing the geometry of the plunger can be described by way of therange of the normal stress in the z direction,

$\frac{1}{3} < \frac{\sigma_{z,{Interface},{averaged}}}{\sigma_{z,{Interface},{center}}} < 1$

where:

Interface, averaged: is the normal stress in z, measured over the crosssection

Interface, center: is the normal stress in z in the center of thecontact region or the adjacent regions in the plunger or optical element

FIG. 10a shows a further variant, in which the optical element 9.3 isconnected to an actuating unit by way of a clamping connection. For thispurpose, a screw 23 is passed through a through-hole 24 in the glass ofthe optical element 9.3. On the side of the screw 23 or of the opticalelement 9.3 that is facing away from the screw head, first a washer 25,then a comparatively flexible spring 26 are arranged, and the spring istightened with respect to the optical element 9.3 by way of a nut 27. Aram 28, which for its part is in mechanically operative connection withthe actuating unit, acts on the washer 25. The effect of the spring 26is essentially that it makes it possible for a defined clamping force tobe applied. The spring constant should in this case be chosen such that,even with a maximum downward deflection of the optical element 9.3, thewasher 25 does not lose contact with the optical element 9.3 and asituation that is difficult to control occurs. On the other hand, thespring constant is small enough to make appropriately sensitive settingof the clamping force possible. Typical values for the spring constantlie in the range of 1 N/μm-0.01 N/μm.

FIG. 10b shows the variant that has been modified with respect to FIG.10a to the extent that now there are peripheral annular grooves 29 onboth sides of the optical element 9.4, performing essentially the samefunction as that known from the previous FIGS. 7-9. The basis for thedesire for annular grooves 29 on both sides in FIG. 10b is that now acomparatively rigid element, specifically the screw head 23 a, is incontact with the optical element 9.4 on the side thereof that is facingaway from the actuator unit.

FIG. 11a shows an approach by which allowance is made for the limitedinstallation space available underneath the optical element 9.5. Theoptical element 9.5 is in this case clamped in between the two arms of aclamp 30—likewise by using a screw 23 and a spring 26; the actuator unitin this case acts on the clamp 30 from outside, as indicated by thedouble-headed arrow. FIG. 11b corresponds to FIG. 11a , but in this casethe optical element 9.6 is provided with the peripheral annular grooves29 that are already known from the previous FIGS. 7-9.

The design of the external part of the groove is generally of far lessrelevance to the introduction of stress into the material of the opticalelement than the design of the part of the groove that is facing thecontact region.

FIGS. 12a and 12b show a beveled design and an elliptical design of thepart of the groove 22.2 and 22.3 that is facing the contact region 36 inthe optical element 9.7 and 9.8. However, these are only two possiblevariants from a large number of possible designs of the groove 22; itgoes without saying that free-form surfaces are also conceivable.

Likewise shown by way of example, in FIGS. 13a and 13b , is an undercuton the side of the groove 22.4 and 22.5 that is facing the contactregion 36 in the optical element 9.9 and 9.10, respectively.

FIGS. 14a and 14b show a variant in which the optical element 9.11 and9.12 is locally weakened in a specifically selective manner outside theoptically active region 9.11′ and 9.12′, respectively, in order toreduce the forces for a deformation of the optical element 9.11 and9.12. The optically active region is intended to be understood in thiscase as meaning the region of an optical element that is passed throughby used radiation during the operation of the higher-level installation.In FIG. 14a , the optical element 9.11 is provided here at its edge withan indentation 31, whereas in FIG. 14b material is cut out in theoptically non-active region, but in the interior of the optical element9.12. The cutout 32 may be either right through or merely made as anotch. The optically non-active region is understood as meaning theregion of the optical element that is not passed through by the usedradiation that is used in the device during the operation of ahigh-level device in which the optical element is used. In both cases,appropriate weakenings of the material are formed at a distance from thecontact region 36.

FIGS. 15a and 15b show two different possibilities for the introductionof forces and moments into an optical element. In the variant shown inFIG. 15a , forces and moments are introduced into the material of theoptical element 9.13 in the edge region of the optical element 9.13,that is to say outside the optically active region 9.13′, respectivelyat a common point of attack, as illustrated by the arrows 33 and 34. Adisadvantage of the solution that is shown in FIG. 15a is that in thiscase a decoupling of the force and moment in the contact region 36 isonly possible to a very restricted extent because a great stiffness inthe actuating direction is advantageous, which is contrary to thedesirable decoupling, and considerable stresses occur in the contactregion 36 of the actuating unit used (not represented in the figure) inthe optical element 9.13 to achieve a desired flexural deformation ofthe optical element 9.13, in particular in the x direction. FIG. 15bshows a variant in which two contact regions 36, in which forces for thedeformation of the optical element 9.14 can act, are respectivelyprovided on each side of the optical element 9.14 outside the opticallyactive region 9.14′. The introduction of moments, in particular oftangential moments, takes place in the example shown by different forcesin each case acting at contact regions 36 that are at a distance fromone another in the x direction. In other words, the desired bendingmoment is applied simply by appropriately choosing the difference in theforces introduced. The respective absolute values of the forces can thenbe set independently of the difference mentioned. This gives rise toincreased possibilities for the deformation of the optical element 9.14,and similarly to a reduction in the stresses that are introduced intothe material of the optical element 9.14 in the contact regions 36.Furthermore, a desired ratio of the two forces can be set by way of thedistance between the two contact regions 36, without the desired momenthaving to be changed, so that an optimization of the stress becomespossible.

A tangential moment should be understood in this connection as meaningin particular a moment at which the vector or the axis of the bendingmoment extends parallel to the edge region of the optical element, thatis to say in particular parallel to an edge of a plane-parallel plate.In this case, the forces applied for applying the bending moment maydiffer not only with respect to their absolute amount but also inparticular with respect to their direction.

FIGS. 16a and 16b show a schematic representation of the introduction ofa force or moment as described above. In this case, the force isintroduced by an actuating unit into the edge region of an opticalelement 9.15 by way of an articulated joint 35 respectively at twocontact regions 36. The parameter b that is shown in the figure in thiscase denotes the distance from the inner contact region to the opticallyactive region 9.15′ of the optical element 9.15, whereas the parameter adenotes the distance from the outer contact region 36 to the opticallyactive region 9.15′ of the optical element 9.15. In this case, the siteof action for the force or the moment coincides with the edge of theoptically active region 9.15′. FIG. 16b shows the actuated case, inwhich different forces are applied by way of the actuating units 8.1 and8.2, so that both a force and a torque act at the site of action. Theeffect of the decoupling joints 35 between the actuating units 8.1 and8.2 and the optical element 9.15, which avoid high stresses in thecontact region 36 or in the area surrounding it, can be seen well in thefigure. In particular, the decoupling joints 35 bring about the effectthat tensile and compressive forces are primarily transferred to thecontact region 36. If the contact region 36 is chosen to be sufficientlylarge, altogether lower tensile and compressive forces are obtained. Inthe most general case, the decoupling effect of the decoupling joint 35may be realized in all directions of the x/y plane. This can be achievedfor example with a thin round wire or a Cardan joint. In the case of thebending of the optical element 9.15 only about one axis, a decouplingeffect of the decoupling joint 35 about this axis is sufficient; in thiscase, a leaf spring may be used. The following advantageously appliesfor the stiffness ratio of the joint in the z and x/y directions:2<k_(z)/k_(xy)<100 with k as the spring constant.

FIG. 17 shows an exemplary distribution of contact regions 36 outsidethe optically active region 9.16′ of the optical element 9.16. Thecontact regions 36 are in this case arranged in a regular grid, where ais the distance of the inner contact regions from the optically activeregion 9.16′ and b is the distance of the outer contact regions 36 fromthe inner contact regions 36. The distance of the contact regions 36from one another in the longitudinal direction of the optical element9.16 is denoted by c. An irregular arrangement of the contact regions isalso conceivable in principle.

It should be the in this case about the distance a that it is endeavoredto arrange the contact regions 36 as close as possible to the opticallyactive region 9.16′, that is to say that a should be chosen to be assmall as possible. The distance b has a direct effect on which torquecan be introduced into the optical element 9.16 in the tangentialdirection with a prescribed actuator force. Distance c should be chosensuch that the desired resolution of the deformation can be achieved. Insimplified terms, the waviness that can be represented by the opticalelement 9.16 increases with decreasing distance c. It goes withoutsaying here that distance c does not necessarily have to be the distancefrom a wave peak to a wave trough. A wave may also run over amultiplicity of contact regions 36. In addition, the surface profile ofthe actuated optical element 9.16 does not necessarily have to beconstant in the y direction. Instead of at a wave peak for small y, theoptical element 9.16 may no longer have any deformation toward itsmiddle and subsequently form a wave trough. The neutral region also doesnot necessarily have to lie in the middle; it goes without saying that amultiplicity even of extremely irregular profiles can be set through theshown optical element 9.16 with the corresponding actuator system. Thedistance a of the centers of the first row of contact regions 36 fromthe optically active region 9.16′ of the optical element 9.16 does nothave to be constant here. In order to keep down the forces, andconsequently the stresses, in the optical element 9.16, and therebyprevent component failure, it is advantageous to choose the value in therange of 1 mm to 12 mm, in particular in the range of 3-10 mm.

The distance b of the centers of the contact regions 36 of the secondrow from that of the first row is advantageously chosen in the range of2 to 10 mm. If the distance is chosen to be too small, excessive forcesare involved to introduce an adequate tangential moment.

If the distance is too great, on the other hand, excessive forces areinvolved to be able to introduce the desired deformations into theoptically active region 9.16′.

It is advantageous to choose for the distance c a value in the range of8 to 40 mm, in particular of 8 to 30 mm.

FIG. 18 shows a variant of the arrangement shown in FIG. 17 of thecontact regions 36 outside the optically active region 9.17′. In thiscase, the contact regions 36 are arranged offset with respect to oneanother in two rows, the lateral offset of the respective contactregions 36 of the two rows in relation to one another being denoted hereby the parameter d. Here, too, the introduction of a tangential momentinto the optical element 9.17 is possible.

It is altogether of advantage to choose the number of contact regions ina range between 14 and 64. In this range, a sufficient deformationresolution of the optical element is achieved with still reasonablestructural expenditure.

Exemplary possible variants of the arrangement of measuring points onthe optical element are explained below on the basis of FIGS. 19 to 21.

Both FIG. 19 and FIG. 20 show a variant in which the measuring points 37or measuring regions that are represented by dashed lines are arrangedoutside the optically active region 9.19′ and 9.20′, respectively, andare offset from the contact regions 36. This opens up the possibility ofboth actuating and measuring from the same side of the optical element9.19 and 9.20, so that the optical element 9.19 and 9.20 can be broughtup on the opposite side comparatively close to adjacent components of aprojection exposure apparatus (for example the reticle). In principle,the measurement may take place directly on the surface of the opticalelement 9.19 and 9.20. Alternatively, it is also conceivable, as alreadydescribed, to measure indirectly by an actuating unit.

In an alternative variant of the disclosure that is not represented, themeasuring points are located in the contact regions or in the regions onthe other face of the optical element that lies opposite from thecontact regions (on the face of the optical element on which the contactpoints do not lie).

In this case, measuring may possibly be carried out close to theoptically active region of the optical element, so that the measuringaccuracy, and consequently the performance, of the system overallincreases. It goes without saying that, as represented by way of examplein FIG. 21, both the contact regions 36 and the measuring points 37 maybe arranged outside the optically active region 9.21′ on the short sideof a rectangular optical element 9.21.

It is of advantage to arrange the measuring points 37 in at least tworows in order to be able to control the drift behavior of the sensorsbetter. In the case where only one row of sensors is used, the drift ofa sensor produces much greater parasitic deformations in the opticallyactive region and reduces the performance of the system, whereby theoptical element is more poorly conditioned from the technical controlaspect. When there is drift of a sensor, in this case all of theactuating units are moved in order to correct this—erroneouslymeasured—deformation. If all of the measuring points lie in one line,there is no control or little control in the y direction, as a result ofwhich the deformation in the optically active region of the opticalelement, and consequently the optical error, increases.

The introduction of a tangential moment is important in particularbecause a waviness produced at the edges of the optical element 9.21 canalso continue into the interior, that is to say the optically activeregion 9.21′ of the optical element 9.21. Without the application of anadditional tangential moment, the desired waviness would possibly onlyoccur at the edges, that is to say in particular also in the opticallynon-active region of the optical element 9.21, and the manipulator wouldnot have its effect.

When choosing the thickness of the optical element in the z direction,various factors have to be taken into consideration. Especially, thestresses introduced into the material of the optical element, inparticular in the area surrounding the contact regions, depend stronglyon the thickness of the optical element. In an extreme case, suchstresses may lead to failure of the component. Consequently, the opticalcorrection potential is reduced in the case of thick optical elements bythe stress-dependent limitation of the maximum deflections of thecorresponding actuating units by the plate thickness. In addition, theparasitic effect of the stress birefringence increases in the case ofthicker optical elements, as a result of which the performance of thesystem as a whole is reduced.

The aforementioned aspects consequently suggest the choice of an opticalelement that is as thin as possible. However, essentially for thereasons described below, there is a lower limit to the thickness of theoptical element. Firstly, a plane-parallel optical element can only beproduced cost-effectively with a certain minimum thickness; secondly, itis desirable to maintain a certain intrinsic stiffness of the opticalelement in order to keep down as much as possible its susceptibility toharmful ambient conditions, such as for example pressure surges from thesurrounding gas.

It has been found that an advantageous choice for the thickness of theoptical element lies in the range of 1.2 mm to 7 mm, in particular inthe range of 1.2 mm to 4 mm. In an advantageous variant of thedisclosure, the choice of an optical element that is as thin as possiblecan be made possible by the measure that is represented on the basis ofFIG. 22 below.

FIG. 22 shows a variant of the disclosure in which the optical element9.22 that is mounted on the plungers 10 by way of the connecting layer11 is shielded from harmful environmental influences, in particular frompressure surges caused by the movement of the reticle stage, via aprotective plate 38 arranged between it and the reticle. The protectiveplate 38 may in this case be chosen to be comparatively thick, inparticular with a thickness in the range of 4 mm-10 mm. The maximumpossible thickness of the protective plate 38 is limited essentially bythe installation space available and by a limitation of the maximumlight path by glass in the system. The protective plate 38 may in thiscase be arranged in particular on the base frame. Sealing from thesurroundings can then be achieved by the non-actuated protective plate38 being sealed with respect to an upper termination of the base frame,which as a result of the rigid connection of the protective plate 38 tothe base frame is much easier than sealing of the actuated opticalelement 9.22 with respect to the base frame. A gas chamber 39, which isonly connected to the outside by an inflow and an outflow and can bepurged in a defined manner, is thereby created essentially between theprotective plate 38 and the optical element 9.22.

The pressure loads that act on the protective plate 38 from thesurroundings are indicated by the arrows.

It is advantageous in principle to mount the protective plate 38 on thebase frame by way of three bearing points. In this case, errors thatcould be caused by a thermal deformation of the protective plate 38 orthe base frame are minimized.

FIG. 23 shows a variant of the design of an optical element 9.23 inconnection with the manipulator described above. In this case, anoptical element 9.23 that is produced for example from quartz glass orcalcium fluoride is provided with a breakout 40 in the region that isnot passed through by the used optical radiation during the customaryoperation of the higher-order projection exposure apparatus 100. Theenvelope 41 of the beam path through the optical element 9.23 islikewise indicated in FIG. 23 and in the following FIGS. 24 and 25. Theoptical element 9.23 is in this case arranged in the customary way in amount 42, which may in particular be arranged between the manipulatorand a further element of a lens. The fact that the optical element 9.23that is shown in the figure is provided with the breakout 40 means thatinstallation space can be created for components of the structurallyhigher-level unit, for example the manipulator 200, so that altogetheran increased packing density of optical elements in a projectionexposure apparatus is achieved. In addition, weight is saved, and thebreakout 40 also creates the possibility of optimizing or controllingthe flow of a purge gas in the system.

FIGS. 24a and 24b show a variant of the solution shown above; theoptical element 9.24 is not provided there with a complete breakout, butrather is milled away in the optically unused regions 40.1. FIG. 24apresents a perspective view of the optical element 9.24, whereas FIG.24b is depicted as a lateral view. The material weakenings 40.1 andbreakouts 40 that are shown in FIGS. 23 and 24 a-24 b may be producedfor example in a final machining step in the production of the opticalelement by milling or similar production processes, such as for examplegrinding.

A further variant of the embodiment shown in FIGS. 23 and 24 a-24 b isFIGS. 25a and 25b . FIG. 25a shows a perspective view of thecorresponding variant, whereas FIG. 25b presents a lateral view.

In the example shown in FIGS. 25a-25b , the outer contour of the opticalelement 9.25 is not of an annular configuration, but rather 3 eyelets43, through which the optical element 9.25 can be screwed for example tothe mount of a further optical element of a projection lens or bemounted on hemispherical bosses, are formed in the example shown.Dispensing with the annular contour allows additional installation spaceto be gained here; furthermore, the overall mass of the optical element9.25 is reduced further, which has considerable advantages with respectto use of the optical element 9.25 in a manipulator.

FIG. 26 shows by way of example a use of the optical element with amanipulator 200, it being evident how the remaining part of the opticalelement protrudes into the free installation space in the manipulator200.

The technical features that are explained on the basis of FIGS. 23 to 26are reproduced once again below, structured in the form of items thatare numbered and refer back to one another.

1. A projection exposure apparatus for semiconductor lithography, havinga manipulator for the correction of wavefront aberrations of the usedoptical radiation that passes through an optical element of themanipulator during the operation of the projection lens, an opticalelement which is provided with a material weakening in the region thatis not passed through by the used optical radiation during the customaryoperation of the projection exposure apparatus being arranged adjacentto the manipulator in the light path, characterized in that the part ofthe optical element that is not provided with the material weakeningprotrudes into a clearance produced by the geometry of the manipulatorand/or in that at least part of the manipulator protrudes into theregion of the material weakening.

2. The projection exposure apparatus as provided by item 1,characterized in that the material weakening is a breakout.

3. The projection exposure apparatus as provided by item 1,characterized in that the material weakening is a milled-away portion orground-away portion.

4. The projection exposure apparatus as provided by one of the precedingitems, characterized in that the outer contour of the optical elementdeviates from the form of a ring, eyelets for the fastening or mountingof the optical element being present on the optical element.

5. The projection exposure apparatus as provided by one of the precedingitems, characterized in that the manipulator is arranged directly aftera reticle of the projection exposure apparatus in the direction of theused optical radiation.

For the purpose of the aforementioned items, a material weakening isintended to be understood as meaning in particular the absence ofmaterial, whereby an originally existing or merely imaginary completeform of the optical element has been reduced or become incomplete. It isfor example conceivable that the optical element is a body ofrevolution, in particular a spherical, rotationally symmetrical lenselement with a clearance, the rotational symmetry being broken as aresult of the presence of the clearance. It is in this case immaterialwhether a complete optical element has first been produced and thenreworked or whether the material weakening was already provided in thedesign of the optical element, so that no reworking was involved toproduce the material weakening. In other words, an optical elementprovided with a material weakening may be understood as meaning inparticular an optical element which, when viewed by a person skilled inthe art, would be imagined as completed in a form of an optical elementthat is familiar to such a person.

The material weakening is consequently a deviation from the customaryform of concave or convex lens elements that goes beyond the materialweakenings associated with the creation of free-form surfaces oraspheres, in particular even by orders of magnitude. In particular, anoptically non-effective region is produced. The material weakening mayfor example also be bordered by a discontinuous profile of the surfaceof the optical element, such as for example an edge.

What is claimed is:
 1. An apparatus, comprising: a projection lenscomprising a manipulator, the manipulator comprising: an opticalelement; a base frame; a sensor frame arranged on the base frame; asensor arranged on the sensor frame; and a supporting frame arranged onthe base frame, wherein: the manipulator is configured to correctwavefront aberrations of used optical radiation that pass through theoptical element during the operation of the projection lens; themanipulator is arranged directly after an object plane of the apparatusalong a path of the used optical radiation; the sensor is configured tomeasure a deformation or a deflection of the optical element; acoefficient of thermal expansion of the sensor frame is within 16 ppm/Kof a coefficient of thermal expansion of the base frame; and thesupporting frame comprises a non-magnetic metallic material, wherein theapparatus is a semiconductor lithography projection exposure apparatus.2. The apparatus of claim 1, wherein the optical element comprises aplane-parallel element.
 3. The apparatus of claim 2, wherein: themanipulator further comprises: actuating units configured to deform ormove the optical element; a mount configured to mount an optical elementof the projection lens which is different from the optical element ofthe manipulator; the actuating units are arranged along a periphery ofthe optical element of the manipulator; the actuating units aremechanically connected to contact regions of the optical element of themanipulator; the actuating units are mechanically connected to the baseframe; the base frame is connected to the mount.
 4. The apparatus ofclaim 3, wherein the optical element of the manipulator is arranged onthe supporting frame via the actuating units.
 5. The apparatus of claim1, wherein: a coefficient of thermal expansion of the supporting frameis within 16 ppm/K of a coefficient of thermal expansion of the baseframe; and the coefficient of thermal expansion of the supporting frameis within 16 ppm/K of a coefficient of thermal expansion of the sensorframe.
 6. The apparatus of claim 3, wherein the actuating unitscomprises actuators which comprise piezo stacks.
 7. The apparatus ofclaim 3, wherein at least one of the actuating units is a shaped as aparallelogram with interior angles configured to be changed by anactuator of the at least one actuating unit.
 8. The apparatus of claim7, wherein the effective direction of the actuator extends in adirection of a diagonal of the parallelogram.
 9. The apparatus of claim3, wherein the sensor is configured to measure a deflection of acomponent of an actuating unit.
 10. The apparatus of claim 1, whereinthe sensor is configured to directly measure a deflection of the opticalelement.
 11. The apparatus of claim 1, wherein the sensor comprises anoptical sensor or encoder.
 12. The apparatus of claim 1, wherein thesensor comprises a capacitive sensor.
 13. The apparatus of claim 1,wherein the sensor comprises a force sensor.
 14. The apparatus of claim1, wherein a plurality of sensors are arranged along a periphery of theoptical element.
 15. The apparatus of claim 1, wherein the sensor framecomprises titanium, a titanium alloy, aluminum, an aluminum alloy,Zerodur, ULE or (Si)Sic.
 16. The apparatus of claim 1, wherein thesensor frame comprises a material having a coefficient of thermalexpansion of from 0 ppm/K to 12 ppm/K.
 17. The apparatus of claim 1,wherein the sensor frame comprises a material having a modulus ofelasticity value of from 60 GPa to 400 GPa.
 18. The apparatus of claim1, further comprising an illumination device configured to illuminatethe object plane during use of the apparatus.
 19. A method of operatinga semiconductor lithography projection exposure apparatus comprising aillumination device and a projection lens, the method comprising: usingthe illumination device to illuminate a reticle; and using theprojection lens to transfer an image of the illuminated reticle onto awafer, wherein the projection lens is a projection lens according toclaim
 1. 20. The apparatus of claim 1, wherein the non-magnetic metallicmaterial comprises a non-magnetic steel.
 21. The apparatus of claim 4,wherein the non-magnetic metallic material comprises a non-magneticsteel.
 22. An apparatus, comprising: a projection lens comprising amanipulator, the manipulator comprising: an optical element; a baseframe; a sensor frame arranged on the base frame; and a sensor arrangedon the sensor frame; a supporting frame arranged on the base frame;actuating units configured to deform or move the optical element,wherein: the manipulator is configured to correct wavefront aberrationsof used optical radiation that pass through the optical element duringthe operation of the projection lens; the manipulator is arrangeddirectly after an object plane of the apparatus along a path of the usedoptical radiation; the sensor is configured to measure a deformation ora deflection of the optical element; the optical element is arranged onthe supporting frame via the actuating units; the actuating units areconfigured to deform or move the optical element; the base framecomprises a first material; the supporting frame comprises a secondmaterial; the sensor frame comprises a third material different fromboth the first material and the second material; a coefficient ofthermal expansion of the the third material is within 16 ppm/K of acoefficient of thermal expansion of the first material; the coefficientof thermal expansion of the third material is within 16 ppm/K of acoefficient of thermal expansion of the second material; and thecoefficient of thermal expansion of the second material is within 16ppm/K of the coefficient of thermal expansion of the first material; andthe apparatus is a semiconductor lithography projection exposureapparatus.